Height-limited type solder preform

The invention relates to the technical field of soldering materials and particularly discloses a height-limited type solder preform. The height-limited type solder preform comprises a solder preform matrix and metal wires. The solder preform matrix is in a cuboid shape. One length*width surface of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MA CHUNCHENG, HOU CHANGGUI, CAI LIESONG, HUANG YAOLIN, ZHAO JINYE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to the technical field of soldering materials and particularly discloses a height-limited type solder preform. The height-limited type solder preform comprises a solder preform matrix and metal wires. The solder preform matrix is in a cuboid shape. One length*width surface of the solder preform matrix is provided with at least two grooves parallel to the width edge of the surface. The length of each groove is equal to that of the width edge of the surface. The depth of each groove is smaller than that of the solder preform. The dimensions of each metal wire are equal to that of each groove, and each metal wire can be just embedded into the corresponding groove to be fixed. The melting point of each metal wire is 300 DEG C or above higher than that of the solder preform matrix. The preparation process of the height-limited type solder preform is simple and easy to operate. The height-limited type solder preform is low in cost, stable in soldering thickness, high in uniformity, low in void