Process for manufacturing of a thick copper wire for bonding applications

A process for the manufacture of a bonding wire comprising a core with a surface, wherein the core comprises >= 98.0% copper and has a cross sectional area in the range of 7500 to 600000 mum2 and an elastic limit RP0.2 (yield strength) in the range of 40 to 95 N/mm2, the process comprising the steps of: a) providing a copper core precursor; b) drawing the precursor until a final diameter of the wire core is reached; c) annealing the drawn wire at a minimum annealing temperature in the range of 650 to 1000 DEGC through its entire cross section for a minimum annealing time in the range of 4 seconds to 2 hours. 种制造接合线的方法，所述接合线包括具有表面的芯，其中所述芯包含≥98.0%的铜，并具有7500至600000 µm范围内的横截面积和40至95 N/mm范围内的弹性极限RP0.2（屈服强度），该方法包括以下步骤：（a）提供铜芯前体；（b）拉制该前体直到达到线芯的最终直径；（c）在650至1000℃范围内的最低退火温度下在其整个横截面上使拉制的线材退火4秒至2小时的最小退火时间。