Electrode terminal, electro-chemical device and electro-chemical device comprising same

The invention provides an electrode terminal including a copper substrate and a metal layer covering at least one surface of the copper substrate, wherein the metal layer includes greater than or equal to about 10 wt % and less than or equal to about 80 wt % of tungsten (W), and an additional metal...

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Bibliographische Detailangaben
Hauptverfasser: ROH, WHAN JIN, JUNG, BYUNGSU, LEE, YUNJU, PARK, KYUNGJOO, JEON, WOOJIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides an electrode terminal including a copper substrate and a metal layer covering at least one surface of the copper substrate, wherein the metal layer includes greater than or equal to about 10 wt % and less than or equal to about 80 wt % of tungsten (W), and an additional metal comprising nickel (Ni), silver (Ag), gold (Au), platinum (Pt), zinc (Zn), iron (Fe), lead (Pb), tin (Sn), molybdenum (Mo), beryllium (Be), rhodium (Rh), iridium (Ir), or a combination thereof. An electro-chemical device and an electro-chemical device module including the same are also disclosed. 本发明提供了种包括铜基材和覆盖铜基材的至少个表面的金属层的电极端子,其中所述金属层包括大于或等于10wt%且小于或等于80wt%的钨(W),和选自镍(Ni)、银(Ag)、金(Au)、铂(Pt)、锌(Zn)、铁(Fe)、铅(Pb)、锡(Sn)、钼(Mo)、铍(Be)、铑(Rh)、铱(Ir)、和其组合的另外的金属。公开了电化学装置和包括该电化学装置的电化学装置模块。