Differential pressure sensor

A differential pressure sensor includes a pressure sensing die including a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is similarly bonded to the opposite side of the semiconductor die. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die. 种压差传感器包括压力感测基座，该压力感测基座包括半导体基座，其具有形成膜的减薄部分。膜包括压阻元件，其呈现基于施加在膜上的力的变化的阻抗。第