Polysilicon filament binding device using polysilicon fragments
The present invention relates to a polysilicon filament manufacturing device, and more specifically, to a polysilicon filament binding device for manufacturing a polysilicon filament having a desired length by connecting polysilicon fragments cut from damage, etc. The present invention provides a po...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present invention relates to a polysilicon filament manufacturing device, and more specifically, to a polysilicon filament binding device for manufacturing a polysilicon filament having a desired length by connecting polysilicon fragments cut from damage, etc. The present invention provides a polysilicon filament binding device comprising: a body part having a barrel-shape; a guide part provided inside the body part, guiding incoming polysilicon fragments; and a main light source for heating the binding surfaces of the polysilicon fragments.
本发明涉及种多晶硅长丝制造装置,更具体地,涉及种通过连接由于损伤等切断的多晶硅碎片来制造具有所需长度的多晶硅长丝的多晶硅长丝结合装置。本发明提供多晶硅长丝结合装置,其包括:具有桶形的主体部分;设置在所述主体部分内的引导部分,引导进入的多晶硅碎片;和用于加热所述多晶硅碎片的结合面的主光源。 |
---|