Method for sealing thermally conductive member
The invention discloses a method for sealing a thermally conductive member. The method comprises: coating the surface of a first thermally conductive member with an insulated second thermally conductive member, the first thermally conductive member being a metal phase change material; fixing the fir...
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| creator | ZENG TING LUO XIAOPING LONG JING MEI QIANJUN FU ZHAOWEI |
| description | The invention discloses a method for sealing a thermally conductive member. The method comprises: coating the surface of a first thermally conductive member with an insulated second thermally conductive member, the first thermally conductive member being a metal phase change material; fixing the first thermally conductive member coated with the second thermally conductive member to a chip on a printed circuit board (PCB), wherein the chip is capable of generating heat during operation; fixing a shield case to the PCB such that the chip fixed to the PCB is positioned in a space formed by the shield case and the PCB, wherein a space formed by the shield case, the PCB, and the chip, is filled with the first thermally conductive member and the second thermally conductive member.
本发明公开了种导热部件的密封方法，包括：利用绝缘的第二导热部件包覆第导热部件表面；所述第导热部件为金属相变材料；将包覆有第二导热部件的第导热部件设置在固定在印制电路板(PCB)上的芯片上；所述芯片在工作时能够产生热量；将屏蔽罩固定在所述PCB上，使得固定在PCB上的芯片位于所述屏蔽罩与所述PCB形成的空间内；其中，所述第导热部件以及所述第二导热部件填充在所述屏蔽罩、PCB以及芯片所形成的空间内。 |
| format | Patent |
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本发明公开了种导热部件的密封方法，包括：利用绝缘的第二导热部件包覆第导热部件表面；所述第导热部件为金属相变材料；将包覆有第二导热部件的第导热部件设置在固定在印制电路板(PCB)上的芯片上；所述芯片在工作时能够产生热量；将屏蔽罩固定在所述PCB上，使得固定在PCB上的芯片位于所述屏蔽罩与所述PCB形成的空间内；其中，所述第导热部件以及所述第二导热部件填充在所述屏蔽罩、PCB以及芯片所形成的空间内。</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170222&DB=EPODOC&CC=CN&NR=106455429A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170222&DB=EPODOC&CC=CN&NR=106455429A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZENG TING</creatorcontrib><creatorcontrib>LUO XIAOPING</creatorcontrib><creatorcontrib>LONG JING</creatorcontrib><creatorcontrib>MEI QIANJUN</creatorcontrib><creatorcontrib>FU ZHAOWEI</creatorcontrib><title>Method for sealing thermally conductive member</title><description>The invention discloses a method for sealing a thermally conductive member. The method comprises: coating the surface of a first thermally conductive member with an insulated second thermally conductive member, the first thermally conductive member being a metal phase change material; fixing the first thermally conductive member coated with the second thermally conductive member to a chip on a printed circuit board (PCB), wherein the chip is capable of generating heat during operation; fixing a shield case to the PCB such that the chip fixed to the PCB is positioned in a space formed by the shield case and the PCB, wherein a space formed by the shield case, the PCB, and the chip, is filled with the first thermally conductive member and the second thermally conductive member.
本发明公开了种导热部件的密封方法，包括：利用绝缘的第二导热部件包覆第导热部件表面；所述第导热部件为金属相变材料；将包覆有第二导热部件的第导热部件设置在固定在印制电路板(PCB)上的芯片上；所述芯片在工作时能够产生热量；将屏蔽罩固定在所述PCB上，使得固定在PCB上的芯片位于所述屏蔽罩与所述PCB形成的空间内；其中，所述第导热部件以及所述第二导热部件填充在所述屏蔽罩、PCB以及芯片所形成的空间内。</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDzTS3JyE9RSMsvUihOTczJzEtXKMlILcpNzMmpVEjOz0spTS7JLEtVyE3NTUot4mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgZmJqamJkaWjsbEqAEADOUqxg</recordid><startdate>20170222</startdate><enddate>20170222</enddate><creator>ZENG TING</creator><creator>LUO XIAOPING</creator><creator>LONG JING</creator><creator>MEI QIANJUN</creator><creator>FU ZHAOWEI</creator><scope>EVB</scope></search><sort><creationdate>20170222</creationdate><title>Method for sealing thermally conductive member</title><author>ZENG TING ; LUO XIAOPING ; LONG JING ; MEI QIANJUN ; FU ZHAOWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106455429A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZENG TING</creatorcontrib><creatorcontrib>LUO XIAOPING</creatorcontrib><creatorcontrib>LONG JING</creatorcontrib><creatorcontrib>MEI QIANJUN</creatorcontrib><creatorcontrib>FU ZHAOWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZENG TING</au><au>LUO XIAOPING</au><au>LONG JING</au><au>MEI QIANJUN</au><au>FU ZHAOWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for sealing thermally conductive member</title><date>2017-02-22</date><risdate>2017</risdate><abstract>The invention discloses a method for sealing a thermally conductive member. The method comprises: coating the surface of a first thermally conductive member with an insulated second thermally conductive member, the first thermally conductive member being a metal phase change material; fixing the first thermally conductive member coated with the second thermally conductive member to a chip on a printed circuit board (PCB), wherein the chip is capable of generating heat during operation; fixing a shield case to the PCB such that the chip fixed to the PCB is positioned in a space formed by the shield case and the PCB, wherein a space formed by the shield case, the PCB, and the chip, is filled with the first thermally conductive member and the second thermally conductive member.
本发明公开了种导热部件的密封方法，包括：利用绝缘的第二导热部件包覆第导热部件表面；所述第导热部件为金属相变材料；将包覆有第二导热部件的第导热部件设置在固定在印制电路板(PCB)上的芯片上；所述芯片在工作时能够产生热量；将屏蔽罩固定在所述PCB上，使得固定在PCB上的芯片位于所述屏蔽罩与所述PCB形成的空间内；其中，所述第导热部件以及所述第二导热部件填充在所述屏蔽罩、PCB以及芯片所形成的空间内。</abstract><oa>free_for_read</oa></addata></record> |
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| title | Method for sealing thermally conductive member |
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