Method for sealing thermally conductive member

The invention discloses a method for sealing a thermally conductive member. The method comprises: coating the surface of a first thermally conductive member with an insulated second thermally conductive member, the first thermally conductive member being a metal phase change material; fixing the first thermally conductive member coated with the second thermally conductive member to a chip on a printed circuit board (PCB), wherein the chip is capable of generating heat during operation; fixing a shield case to the PCB such that the chip fixed to the PCB is positioned in a space formed by the shield case and the PCB, wherein a space formed by the shield case, the PCB, and the chip, is filled with the first thermally conductive member and the second thermally conductive member. 本发明公开了种导热部件的密封方法，包括：利用绝缘的第二导热部件包覆第导热部件表面；所述第导热部件为金属相变材料；将包覆有第二导热部件的第导热部件设置在固定在印制电路板(PCB)上的芯片上；所述芯片在工作时能够产生热量；将屏蔽罩固定在所述PCB上，使得固定在PCB上的芯片位于所述屏蔽罩与所述PCB形成的空间内；其中，所述第导热部件以及所述第二导热部件填充在所述屏蔽罩、PCB以及芯片所形成的空间内。