Photoelectric coupler package structure used for large-scale integration

Disclosed is a photoelectric coupler package structure used for large-scale integration. The photoelectric coupler package structure comprises a ceramic substrate, a lid, a light-emitting diode, a photosensitive chip and multiple metal conduction bands. The photoelectric coupler package structure used for large-scale integration has the advantages that the photoelectric coupler package structure used for the large-scale integration is provided. According to the technical scheme, only a simple non-airtight packaging is conducted on the photoelectric coupler unit, and an overall airtight packaging is conducted on the photoelectric coupler unit and other elements; meanwhile, thanks to the reduction of dimension of the photoelectric coupler unit, a total volume of a device after the large-scale integration can be sharply reduced. 种用于大规模集成的光电耦合器封装结构，所述光电耦合器封装结构由陶瓷基板、盖子、发光二极管、光敏芯片和多条金属导带组成；本发明的有益技术效果是：提出了种用于大规模集成的光电耦合器封装结构，该方案针对光电耦合器单元仅作简单的非气密性封装，然后再将光电耦合器单元与其他元件整体进行气密封装，得益于光电耦合器单元的尺寸缩减，大规模集成后的装置总体积可以得到大幅缩减。