Wafer level packaging based MEMS wind speed and wind direction sensor structure and packaging method

The invention discloses a water level packaging based MEMS wind speed and wind direction sensor structure and packaging method. The method comprises the following steps. The front side of a silicon wafer is reversely welded in the wafer level packaging manner onto a ceramic substrate; the back side of the ceramic substrate is used as an interface where the sensors are in contact with the wind. Only through the low temperature bonding between the silicon wafer and the ceramic substrate and among the sensors in different areas, the silicon chip is capable of connecting the central temperature measuring device, the heating device and the heat transmitting and temperature measuring device to a circuit to perform control and detection. In order to achieve better heat contact between the silicon chip and the ceramic substrate, the heating ends of the heating device, the central temperature measuring device and the heat transmitting and temperature measuring device are closely attached to the ceramic substrate. In t