Workpiece surface laser shocking process utilizing surface micro textures for removing residual stress holes
The invention relates to a workpiece surface laser shocking process utilizing surface micro textures for removing residual stress holes. Micro texture laser parameters are optimized, the purpose of releasing residual stress is achieved through array micropores formed by the laser micro textures, and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a workpiece surface laser shocking process utilizing surface micro textures for removing residual stress holes. Micro texture laser parameters are optimized, the purpose of releasing residual stress is achieved through array micropores formed by the laser micro textures, and meanwhile, the micropores formed by the micro textures play a role in blocking in the rarefaction wave transmitting process, surface converged waves cannot arrive at a light spot center, the residual stress holes cannot be formed, and a PDVF piezoelectric sensor is used for carrying out monitoring on the workpiece surface to ensure that rarefaction waves cannot be converged towards the light spot center. In addition, the laser parameter of laser shocking peening is converted into a laser parameter of deionized water serving as a restraint layer, and therefore the process can be applied to the industry on a large scale. The process is used for carrying out laser shocking peening treatment on the workpiece surface, |
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