Surface-mounted power device integrated welding method
The invention discloses a surface-mounted power device integrated welding method which comprises the steps of: S1, carrying out gold removal tinning processing on SMD (Surface-Mount Device); S2, printing terminal soldering paste on a corresponding position on a ceramic copper-clad laminate; S3, plac...
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| creator | GUO XIAOLIN CHEN JIUXIN |
| description | The invention discloses a surface-mounted power device integrated welding method which comprises the steps of: S1, carrying out gold removal tinning processing on SMD (Surface-Mount Device); S2, printing terminal soldering paste on a corresponding position on a ceramic copper-clad laminate; S3, placing a terminal at a corresponding position on the ceramic copper-clad laminate; S4, horizontally placing the ceramic copper-clad laminate which is mounted well into a vacuum reflow soldering furnace of which a temperature is set well to carry out welding; S5, printing the soldering paste onto corresponding positions on components and an aluminum silicon carbide substrate; S6, mounting the components onto the ceramic copper-clad laminate, then horizontally mounting the ceramic copper-clad laminate onto the aluminum silicon carbide substrate, and applying a certain pressure to enable the soldering paste between the ceramic copper-clad laminate and the aluminum silicon carbide substrate to be in sufficient contact; S7 |
| format | Patent |
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S2, printing terminal soldering paste on a corresponding position on a ceramic copper-clad laminate; S3, placing a terminal at a corresponding position on the ceramic copper-clad laminate; S4, horizontally placing the ceramic copper-clad laminate which is mounted well into a vacuum reflow soldering furnace of which a temperature is set well to carry out welding; S5, printing the soldering paste onto corresponding positions on components and an aluminum silicon carbide substrate; S6, mounting the components onto the ceramic copper-clad laminate, then horizontally mounting the ceramic copper-clad laminate onto the aluminum silicon carbide substrate, and applying a certain pressure to enable the soldering paste between the ceramic copper-clad laminate and the aluminum silicon carbide substrate to be in sufficient contact; S7</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Surface-mounted power device integrated welding method |
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