Surface-mounted power device integrated welding method
The invention discloses a surface-mounted power device integrated welding method which comprises the steps of: S1, carrying out gold removal tinning processing on SMD (Surface-Mount Device); S2, printing terminal soldering paste on a corresponding position on a ceramic copper-clad laminate; S3, plac...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a surface-mounted power device integrated welding method which comprises the steps of: S1, carrying out gold removal tinning processing on SMD (Surface-Mount Device); S2, printing terminal soldering paste on a corresponding position on a ceramic copper-clad laminate; S3, placing a terminal at a corresponding position on the ceramic copper-clad laminate; S4, horizontally placing the ceramic copper-clad laminate which is mounted well into a vacuum reflow soldering furnace of which a temperature is set well to carry out welding; S5, printing the soldering paste onto corresponding positions on components and an aluminum silicon carbide substrate; S6, mounting the components onto the ceramic copper-clad laminate, then horizontally mounting the ceramic copper-clad laminate onto the aluminum silicon carbide substrate, and applying a certain pressure to enable the soldering paste between the ceramic copper-clad laminate and the aluminum silicon carbide substrate to be in sufficient contact; S7 |
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