Thin type array plastic packaging part and production method thereof

The invention relates to a thin type array plastic packaging part, including a carrier, lead bonding pads, grounding rings, an IC chip, bonding wires, a plastic packaging body and solder balls. The middle position of the carrier is a chip bonding area DAP, the chip bonding area DAP is provided with the IC chip, edges of the carrier are provided with the grounding rings, and the grounding rings are formed by multiple layers of metals which are superposed on the carrier; the lead bonding pads are arranged at the periphery of the carrier in a multi-row array mode, and are composed of multiple layers of metals; the IC chip is electrically connected to the lead bonding pads and the grounding rings through the bonding wires; the packaging body is used for wrapping the IC chip, the bonding wires, the lead bonding pads and part of the carrier, and the bottom of the carrier is exposed outside the packaging body; and the solder balls are arranged at the bottom of the packaging body, and are connected with the lead bond