VISION-BASED WAFER NOTCH POSITION MEASUREMENT

A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset. 本发明涉及基于可视的晶片凹口的位置测量。种晶片对准系统包括捕获定位在基座上的晶片的图像的图像捕获设备。图像分析模块分析所述图像以检测晶片的边缘与形成在晶片的边缘的凹口并且基于所述凹口的位置计算对应于晶片的边缘的第边缘位置和第二边缘位置。偏移计算模块基于第边缘位置和第二边缘位置计算晶片的角度偏移。系统控制模块基于该角度偏移控制晶片从基座到处理单元的传送。