COMPOSITION FOR FORMING SILICA LAYER, METHOD FOR MANUFACTURING SILICA LAYER, SILICA LAYER AND ELECTRONIC DEVICE

The invention provides a composition for forming a silica layer, a method for manufacturing the silica layer, the silica layer and an electronic device. A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mix...

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Hauptverfasser: SEO, JINWOO, KIM, JINGYO, LEE, EUNSEON, NA, YOONG HEE, JANG, JUNYOUNG, YUN, HUICHAN, KWAK, TAEKSOO, BAE, JIN-HEE, KIM, HANEUL, HWANG, BYEONGGYU, NOH, KUNBAE, KIM, WOO HAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a composition for forming a silica layer, a method for manufacturing the silica layer, the silica layer and an electronic device. A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25 DEG C. 本发明提供种用于形成氧化硅层的组合物、制造氧化硅层的方法、氧化硅层及电子装置。用于形成氧化硅层的组合物包含含硅聚合物和包含至少两种溶剂的混合溶剂,其中所述混合溶剂在25℃下的表面张力是5毫牛/米至35毫牛/米。本发明的用于形成氧化硅层的组合物能够提供具有小缺陷和均厚度的氧化硅层。