Chip composite component and preparation method thereof
The invention discloses a chip composite component and a preparation method thereof. The chip composite component comprises a ceramic body and a resistor. The ceramic body comprises a first dielectric layer which is provided with a first surface and a second surface which are opposite; a first elect...
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creator | LU HENG YANG XIAODONG ZHUO JINLI LI HONGGANG ZENG YU NIE LINLIN LI JIANGZHU LIANG QINHUA |
description | The invention discloses a chip composite component and a preparation method thereof. The chip composite component comprises a ceramic body and a resistor. The ceramic body comprises a first dielectric layer which is provided with a first surface and a second surface which are opposite; a first electrode layer which is formed on the first surface of the first dielectric layer; a second electrode layer which is formed on the second surface of the first dielectric layer, wherein one side of the second electrode layer and one side of the second surface are at least partially leveled so as to form a lead-out side; a second dielectric layer which is laminated on the surface of the second electrode layer and completely covers the second surface; and a third electrode layer which is formed on the surface of one side, which is away from the first dielectric layer, of the second dielectric layer, wherein the orthographic projection of the third electrode layer on the second electrode layer completely falls in the secon |
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The chip composite component comprises a ceramic body and a resistor. The ceramic body comprises a first dielectric layer which is provided with a first surface and a second surface which are opposite; a first electrode layer which is formed on the first surface of the first dielectric layer; a second electrode layer which is formed on the second surface of the first dielectric layer, wherein one side of the second electrode layer and one side of the second surface are at least partially leveled so as to form a lead-out side; a second dielectric layer which is laminated on the surface of the second electrode layer and completely covers the second surface; and a third electrode layer which is formed on the surface of one side, which is away from the first dielectric layer, of the second dielectric layer, wherein the orthographic projection of the third electrode layer on the second electrode layer completely falls in the secon</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRICITY</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170208&DB=EPODOC&CC=CN&NR=106384681A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170208&DB=EPODOC&CC=CN&NR=106384681A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU HENG</creatorcontrib><creatorcontrib>YANG XIAODONG</creatorcontrib><creatorcontrib>ZHUO JINLI</creatorcontrib><creatorcontrib>LI HONGGANG</creatorcontrib><creatorcontrib>ZENG YU</creatorcontrib><creatorcontrib>NIE LINLIN</creatorcontrib><creatorcontrib>LI JIANGZHU</creatorcontrib><creatorcontrib>LIANG QINHUA</creatorcontrib><title>Chip composite component and preparation method thereof</title><description>The invention discloses a chip composite component and a preparation method thereof. The chip composite component comprises a ceramic body and a resistor. The ceramic body comprises a first dielectric layer which is provided with a first surface and a second surface which are opposite; a first electrode layer which is formed on the first surface of the first dielectric layer; a second electrode layer which is formed on the second surface of the first dielectric layer, wherein one side of the second electrode layer and one side of the second surface are at least partially leveled so as to form a lead-out side; a second dielectric layer which is laminated on the surface of the second electrode layer and completely covers the second surface; and a third electrode layer which is formed on the surface of one side, which is away from the first dielectric layer, of the second dielectric layer, wherein the orthographic projection of the third electrode layer on the second electrode layer completely falls in the secon</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB3zsgsUEjOzy3IL84sSYWw8lLzShQS81IUCopSCxKLEksy8_MUclNLMvJTFEoyUotS89N4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8s5-hgZmxhYmZhaGjMTFqAP5kLlg</recordid><startdate>20170208</startdate><enddate>20170208</enddate><creator>LU HENG</creator><creator>YANG XIAODONG</creator><creator>ZHUO JINLI</creator><creator>LI HONGGANG</creator><creator>ZENG YU</creator><creator>NIE LINLIN</creator><creator>LI JIANGZHU</creator><creator>LIANG QINHUA</creator><scope>EVB</scope></search><sort><creationdate>20170208</creationdate><title>Chip composite component and preparation method thereof</title><author>LU HENG ; YANG XIAODONG ; ZHUO JINLI ; LI HONGGANG ; ZENG YU ; NIE LINLIN ; LI JIANGZHU ; LIANG QINHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106384681A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>LU HENG</creatorcontrib><creatorcontrib>YANG XIAODONG</creatorcontrib><creatorcontrib>ZHUO JINLI</creatorcontrib><creatorcontrib>LI HONGGANG</creatorcontrib><creatorcontrib>ZENG YU</creatorcontrib><creatorcontrib>NIE LINLIN</creatorcontrib><creatorcontrib>LI JIANGZHU</creatorcontrib><creatorcontrib>LIANG QINHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU HENG</au><au>YANG XIAODONG</au><au>ZHUO JINLI</au><au>LI HONGGANG</au><au>ZENG YU</au><au>NIE LINLIN</au><au>LI JIANGZHU</au><au>LIANG QINHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip composite component and preparation method thereof</title><date>2017-02-08</date><risdate>2017</risdate><abstract>The invention discloses a chip composite component and a preparation method thereof. The chip composite component comprises a ceramic body and a resistor. The ceramic body comprises a first dielectric layer which is provided with a first surface and a second surface which are opposite; a first electrode layer which is formed on the first surface of the first dielectric layer; a second electrode layer which is formed on the second surface of the first dielectric layer, wherein one side of the second electrode layer and one side of the second surface are at least partially leveled so as to form a lead-out side; a second dielectric layer which is laminated on the surface of the second electrode layer and completely covers the second surface; and a third electrode layer which is formed on the surface of one side, which is away from the first dielectric layer, of the second dielectric layer, wherein the orthographic projection of the third electrode layer on the second electrode layer completely falls in the secon</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY |
title | Chip composite component and preparation method thereof |
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