Chip composite component and preparation method thereof

The invention discloses a chip composite component and a preparation method thereof. The chip composite component comprises a ceramic body and a resistor. The ceramic body comprises a first dielectric layer which is provided with a first surface and a second surface which are opposite; a first electrode layer which is formed on the first surface of the first dielectric layer; a second electrode layer which is formed on the second surface of the first dielectric layer, wherein one side of the second electrode layer and one side of the second surface are at least partially leveled so as to form a lead-out side; a second dielectric layer which is laminated on the surface of the second electrode layer and completely covers the second surface; and a third electrode layer which is formed on the surface of one side, which is away from the first dielectric layer, of the second dielectric layer, wherein the orthographic projection of the third electrode layer on the second electrode layer completely falls in the secon