Preparation method of polyimide film with low dielectric constant and low dielectric loss factor

The invention discloses a preparation method of a polyimide film with a low dielectric constant and a low dielectric loss factor. Dianhydride and diamine are adopted for preparing a polyamide acid solution, and the polyamide acid solution and additives such as nanometer fluorine-containing macromole...

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Bibliographische Detailangaben

1. Verfasser:	CEN JIANJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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