Preparation method of polyimide film with low dielectric constant and low dielectric loss factor

The invention discloses a preparation method of a polyimide film with a low dielectric constant and a low dielectric loss factor. Dianhydride and diamine are adopted for preparing a polyamide acid solution, and the polyamide acid solution and additives such as nanometer fluorine-containing macromolecule powder, nanometer aluminum oxide powder and nanometer silicon dioxide powder are prepared into the polyimide film. The preparation method is characterized in that the additives account for 10-50% of the weight of polyamide acid. The obtained polyimide film with the low dielectric constant and the lower dielectric loss factor can achieve the effects that the dielectric constant is smaller than or equal to 2.6, the dielectric loss factor is smaller than or equal to 0.003 on the basis of keeping good mechanical properties, the technology is simple, and raw materials are easy to purchase and low in price. 本发明公开了种低介电常数低介电损耗因子的聚酰亚胺薄膜的制备方法，包括采用二酐和二胺制备成聚酰胺酸溶液，并和纳米级含氟高分子粉体、纳米级三氧化二铝粉体、纳米级二氧化硅粉体等添加剂起制备聚酰亚胺薄膜，其特征是所述添加剂占聚酰