Packaging structure with electromagnetic shielding grounding function and manufacturing method thereof

The invention relates to a packaging structure with electromagnetic shielding grounding function and a manufacturing method thereof. The structure comprises a substrate (1), of which the front side is mounted with a plate sheet (2), which comprises an adhesive layer (2.1), a non-conductive dielectric layer (2.2) and a copper foil (2.3), wherein the copper foil (2.3) is connected with the ground line (1.1) of the substrate (1), and the plate sheet (2) is provided with an opening (3). A chip (4) is arranged above the opening (3), the back of the chip (4) is connected with the substrate (1) through a plurality of solder bumps (5), and the outer surface of the chip (4) is encapsulated with plastic (6). The side surface of the substrate (1), the side surface of the plate sheet (2) and the outer surface of the plastic (6) are covered with a shielding metallic layer (7). The packaging structure with electromagnetic shielding grounding function and the manufacturing method thereof solve the problem of poor grounding