Film forming apparatus with injector and method for forming semiconductor device

The invention provides a thin film forming apparatus and a method for forming a semiconductor device. The thin film forming apparatus includes: an injector, the injector including: a distributor including a first distribution portion connected to a first gas inlet, and a second distribution portion...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HAN KYUHEE, CHO NAMJIN, KIM YEONTAE, PARK KEESOO, CHOI EUNSOK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides a thin film forming apparatus and a method for forming a semiconductor device. The thin film forming apparatus includes: an injector, the injector including: a distributor including a first distribution portion connected to a first gas inlet, and a second distribution portion connected to a second gas inlet; and a guide connected to the distributor, the guide including a first outlet connected to the first distribution portion, and a second outlet connected to the second distribution portion, wherein the second outlet is disposed above the first outlet. 本公开提供了种薄膜形成装置和形成半导体器件的方法。该薄膜形成装置包括注射器，该注射器包括：分配器，包括连接到第进气口的第分配部分以及连接到第二进气口的第二分配部分；以及引导件，连接到分配器，该引导件包括连接到第分配部分的第出口以及连接到第二分配部分的第二出口，其中第二出口设置在第出口上方。