A feature tiered cutting method and device
The embodiments of the invention provide a feature tiered cutting method comprising the steps of acquiring the primitive vector data of a feature; judging whether the number of to-be-cut tiers is greater than or equal to two, and if yes, cutting the feature into sub-features in the corresponding tie...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiments of the invention provide a feature tiered cutting method comprising the steps of acquiring the primitive vector data of a feature; judging whether the number of to-be-cut tiers is greater than or equal to two, and if yes, cutting the feature into sub-features in the corresponding tiers according to a descending order of the to-be-cut tiers. The embodiments of the invention also provide a feature tiered cutting device. The feature tiered cutting method and device increase the feature cutting efficiency.
本发明实施例公开了种图元分层切割方法,所述方法包括:获取图元的原始矢量数据;判断待切割层级的数量是否大于或等于两个,如果是,则按照待切割层级由高到低的顺序,将图元切割为对应层级中的子图元。本发明实施例还公开了种图元分层切割装置。本发明实现了提高了图元切割效率的目的。 |
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