Packaging structure having shielding effect and manufacturing method thereof
The invention relates to a packaging structure having a shielding effect and a manufacturing method thereof. The packaging structure comprises a lead frame, wherein the lead frame comprises a metal line layer (1) and an outer lead pin (2), the periphery of the metal line layer (1) and the outer lead...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a packaging structure having a shielding effect and a manufacturing method thereof. The packaging structure comprises a lead frame, wherein the lead frame comprises a metal line layer (1) and an outer lead pin (2), the periphery of the metal line layer (1) and the outer lead pin (2) are packaged with a first plastic material (3), a metal plate (4) is arranged on the front side of the lead frame, a hole (5) is formed in the metal plate (4), a chip (6) is arranged in the region of the hole (5), the periphery of the metal plate (4) and the chip (6) is packaged with a second plastic material (7), the side face of the lead frame, the side face of the metal plate (4) and the outer surface of the second plastic material (7) are coated with a shielding metal layer (8), and the shielding metal layer (8) is connected with the side face of the metal plate (4). The problem of the poor grounding effect in the prior part can be solved, the production efficiency can be improved, a process can be sim |
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