Epoxy resin composition with high Tg value and method for preparing epoxy resin composition

The invention relates to an epoxy resin composition with a high Tg value. The epoxy resin composition comprises, by weight, 20-30% of phenolic epoxy resin, 15-20% of phenolic resin, 20-30% of brominated epoxy resin, 0.1-1.0% of catalysts, 20-30% of diluents and 2-5% of UV (ultraviolet) functional re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI PEIDE, XIAO BIHUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!