Epoxy resin composition with high Tg value and method for preparing epoxy resin composition

The invention relates to an epoxy resin composition with a high Tg value. The epoxy resin composition comprises, by weight, 20-30% of phenolic epoxy resin, 15-20% of phenolic resin, 20-30% of brominated epoxy resin, 0.1-1.0% of catalysts, 20-30% of diluents and 2-5% of UV (ultraviolet) functional reagents. Tetrafunctional epoxy resin and/or fluorescent whitening agents are mixed with one another to obtain the UV functional reagents. The epoxy resin composition has the advantages that the Tg can reach 170 Celsius degree at least after the epoxy resin composition and phenolic resin are solidified, accordingly, certain special technological requirements, such as requirements on high heat resistance, of PCB (printed circuit boards) can be met, and the epoxy resin composition is safe and reliable and has a high economic benefit. 本发明涉及种具有高Tg值的环氧树脂组合物，其配方按照质量百分比包含以下组分：酚醛环氧树脂20～30％；酚醛树脂15～20％；溴化环氧树脂20～30％；催化剂0.1～1.0％；稀释剂20～30％；UV功能试剂2～5％；其中UV功能试剂为四官能环氧树脂和/或荧光增白剂混合。本发明所述的环氧树脂组合物与酚醛树脂固化后Tg可达到170摄氏度以上，可满足PCB有些特殊工艺要求如要求较