3D printing technology-based metal reinforcement and FPC grounding method
The invention discloses a 3D printing technology-based metal reinforcement and FPC grounding method which is low in cost and ensures metal reinforcement and FPC grounding in low resistance. The method comprises the following steps of (1) 3D printing material preparation: selecting a nanoscale silver...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a 3D printing technology-based metal reinforcement and FPC grounding method which is low in cost and ensures metal reinforcement and FPC grounding in low resistance. The method comprises the following steps of (1) 3D printing material preparation: selecting a nanoscale silver paste material according to the matching requirements of a 3D printer; (2) surface treatment of metal reinforcement: protecting a non-grounding surface of the metal reinforcement by use of a nickel-gold electro (chemical) plating resistant material and carrying out conventional nickel-gold electro (chemical) plating treatment on a grounding surface of the metal reinforcement; (3) design of print grounding points: designing the print grounding points on an FPC or the metal reinforcement; and (4) 3D printing: infiltrating silver paste into reserved holes in the FPC or the metal reinforcement through the 3D printer and enabling the metal reinforcement and the FPC to be grounded and conductive. The 3D printing technol |
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