SEMICONDUCTOR DEVICE INCLUDING A CLIP

A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering. 种半导体装置包括：包括管芯焊盘与引线的引线框架、半导体芯片以及夹件。所述半导体芯片具有第侧以及与所述第侧相反的第二侧。所述第侧附接至所述管芯焊盘并且所述第二侧包括第接合盘与第二接合盘。所述夹件将所述第接合盘电耦接至所述引线。所述夹件在所述第接合盘的与所述第二接合盘相邻的第边缘部分处接触所述第接合盘并且在所述第接合盘的中央部分与所述夹件之间限定第腔。焊料位于所述第腔内以将所述夹件电耦接至所述第接合盘。所述半导体装置包括通向所述第腔