Semiconductor device and manufacturing method thereof

Provided are a semiconductor device and a method for manufacturing such a semiconductor. A method may incorporate a substrate, a first word line pad formed on the substrate, and a second word line pad formed on the substrate. The space is located between the first word line pad and the second word line pad and comprises a first space width represented as a and a second space width represented as b. The width a of the first space is smaller than the width of the second space b. The method comprises a self-aligned two-fold pattern array and a surrounding zone and provides the semiconductor device formed by manufacture of pattern steps combined. 本发明公开了种半导体装置及其制造方法。该半导体装置包括：基板；第字线垫(word line pad)，形成于该基板上；以及第二字线垫，形成于该基板上；其中间距(space)位于该第字线垫和该第二字线垫之间，该间距包括第间距宽度和第二间距宽度，该第间距宽度是以a表示，该第二间距宽度是以b表示，其中该第间距宽度a小于该第二间距宽度b。该方法可包括以自对准二重图案化步骤图案化阵列和周边区、并提供以此结合的图案化步骤制作而成的半导体装置。