A conductive pattern forming substrate and a substrate manufacturing method
The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provide...
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creator | HIROYUKI ENDO YUZURU KUDOH |
description | The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provided with a transparent conductive layer (102) and a conductive pattern (110), the conductive pattern (110) includes a graphical transparent conductive layer (111) disposed on the surface of a transparent substrate (101), being continuous with the transparent conductive layer (102) and forming a designated pattern, and a metal layer (112) formed on the surface of the graphical transparent conductive layer (111) and comprising a conductive material adopting metal particles as main components.
本发明提供种在导电图形进步高精细化的同时,还能够抑制对导电图形或透明底板的损害的导电图形形成底板。其特征是在具有透明导电层(102)和导电图形(110)的导电图形形成底板(1)中,导电图形(110)包括有在透明底板(101)的表面上与透明导电层(102)连续并形成为指定图形的图形化的透明导电层(111),和在图形化的透明导电层(111)的表面由以金属粒子为主要成分的导电材料组成的图形化的金属层(112)。 |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN106251944A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN106251944A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN106251944A3</originalsourceid><addsrcrecordid>eNrjZPB2VEjOz0spTS7JLEtVKEgsKUktylNIyy_KzcxLVyguTSouKUosSVVIzEtRSETi5ybmlaYlJpeUFoHU5aaWZOSn8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QwMzI1NDSxMTR2Ni1AAAmNw1-g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A conductive pattern forming substrate and a substrate manufacturing method</title><source>esp@cenet</source><creator>HIROYUKI ENDO ; YUZURU KUDOH</creator><creatorcontrib>HIROYUKI ENDO ; YUZURU KUDOH</creatorcontrib><description>The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provided with a transparent conductive layer (102) and a conductive pattern (110), the conductive pattern (110) includes a graphical transparent conductive layer (111) disposed on the surface of a transparent substrate (101), being continuous with the transparent conductive layer (102) and forming a designated pattern, and a metal layer (112) formed on the surface of the graphical transparent conductive layer (111) and comprising a conductive material adopting metal particles as main components.
本发明提供种在导电图形进步高精细化的同时,还能够抑制对导电图形或透明底板的损害的导电图形形成底板。其特征是在具有透明导电层(102)和导电图形(110)的导电图形形成底板(1)中,导电图形(110)包括有在透明底板(101)的表面上与透明导电层(102)连续并形成为指定图形的图形化的透明导电层(111),和在图形化的透明导电层(111)的表面由以金属粒子为主要成分的导电材料组成的图形化的金属层(112)。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161221&DB=EPODOC&CC=CN&NR=106251944A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161221&DB=EPODOC&CC=CN&NR=106251944A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIROYUKI ENDO</creatorcontrib><creatorcontrib>YUZURU KUDOH</creatorcontrib><title>A conductive pattern forming substrate and a substrate manufacturing method</title><description>The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provided with a transparent conductive layer (102) and a conductive pattern (110), the conductive pattern (110) includes a graphical transparent conductive layer (111) disposed on the surface of a transparent substrate (101), being continuous with the transparent conductive layer (102) and forming a designated pattern, and a metal layer (112) formed on the surface of the graphical transparent conductive layer (111) and comprising a conductive material adopting metal particles as main components.
本发明提供种在导电图形进步高精细化的同时,还能够抑制对导电图形或透明底板的损害的导电图形形成底板。其特征是在具有透明导电层(102)和导电图形(110)的导电图形形成底板(1)中,导电图形(110)包括有在透明底板(101)的表面上与透明导电层(102)连续并形成为指定图形的图形化的透明导电层(111),和在图形化的透明导电层(111)的表面由以金属粒子为主要成分的导电材料组成的图形化的金属层(112)。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB2VEjOz0spTS7JLEtVKEgsKUktylNIyy_KzcxLVyguTSouKUosSVVIzEtRSETi5ybmlaYlJpeUFoHU5aaWZOSn8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QwMzI1NDSxMTR2Ni1AAAmNw1-g</recordid><startdate>20161221</startdate><enddate>20161221</enddate><creator>HIROYUKI ENDO</creator><creator>YUZURU KUDOH</creator><scope>EVB</scope></search><sort><creationdate>20161221</creationdate><title>A conductive pattern forming substrate and a substrate manufacturing method</title><author>HIROYUKI ENDO ; YUZURU KUDOH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106251944A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>HIROYUKI ENDO</creatorcontrib><creatorcontrib>YUZURU KUDOH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIROYUKI ENDO</au><au>YUZURU KUDOH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A conductive pattern forming substrate and a substrate manufacturing method</title><date>2016-12-21</date><risdate>2016</risdate><abstract>The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provided with a transparent conductive layer (102) and a conductive pattern (110), the conductive pattern (110) includes a graphical transparent conductive layer (111) disposed on the surface of a transparent substrate (101), being continuous with the transparent conductive layer (102) and forming a designated pattern, and a metal layer (112) formed on the surface of the graphical transparent conductive layer (111) and comprising a conductive material adopting metal particles as main components.
本发明提供种在导电图形进步高精细化的同时,还能够抑制对导电图形或透明底板的损害的导电图形形成底板。其特征是在具有透明导电层(102)和导电图形(110)的导电图形形成底板(1)中,导电图形(110)包括有在透明底板(101)的表面上与透明导电层(102)连续并形成为指定图形的图形化的透明导电层(111),和在图形化的透明导电层(111)的表面由以金属粒子为主要成分的导电材料组成的图形化的金属层(112)。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
title | A conductive pattern forming substrate and a substrate manufacturing method |
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