A conductive pattern forming substrate and a substrate manufacturing method

The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provide...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HIROYUKI ENDO, YUZURU KUDOH
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention provides a conductive pattern forming substrate further highly refining a conductive pattern and inhibiting damage to conductive patterns or transparent substrates. The conductive pattern forming substrate is characterized in that in the conductive pattern forming substrate (1) provided with a transparent conductive layer (102) and a conductive pattern (110), the conductive pattern (110) includes a graphical transparent conductive layer (111) disposed on the surface of a transparent substrate (101), being continuous with the transparent conductive layer (102) and forming a designated pattern, and a metal layer (112) formed on the surface of the graphical transparent conductive layer (111) and comprising a conductive material adopting metal particles as main components. 本发明提供种在导电图形进步高精细化的同时,还能够抑制对导电图形或透明底板的损害的导电图形形成底板。其特征是在具有透明导电层(102)和导电图形(110)的导电图形形成底板(1)中,导电图形(110)包括有在透明底板(101)的表面上与透明导电层(102)连续并形成为指定图形的图形化的透明导电层(111),和在图形化的透明导电层(111)的表面由以金属粒子为主要成分的导电材料组成的图形化的金属层(112)。