Substrate treatment device, substrate treatment method, and substrate treatment program

Provided is a substrate treatment device provided with a control unit for controlling the treatment of a substrate in accordance with a treatment procedure set in a process recipe, wherein the process recipe is linked to a plurality of partial recipes obtained by unitizing the treatment procedure by function, and the control unit controls the treatment of the substrate in accordance with treatment procedures set in the linked plurality of partial recipes. 提供种基板处理装置，该基板处理装置具备按照加工制程中设定的处理过程来控制基板的处理的控制部，其中，所述加工制程与将所述处理过程按功能进行区分且单元化而得到的多个部分制程链接，所述控制部按照所链接的所述多个部分制程中设定的处理过程来控制基板的处理。