Method for producing cured product of episulfide-based resin

The present invention can provide a method for producing a cured product of an episulfide-based resin, the method having: (A) a step for obtaining a composition for a resin by mixing compound (a), compound (b) and a polymerization catalyst; (B) a step for pouring the composition for a resin into a m...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUSE SAWAKO, KOSHIISHI EIJI, NAMIKI KOUSUKE, FURUKAWA KIKUO, HORIKOSHI HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON CONTACT LENSES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECTACLES SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention can provide a method for producing a cured product of an episulfide-based resin, the method having: (A) a step for obtaining a composition for a resin by mixing compound (a), compound (b) and a polymerization catalyst; (B) a step for pouring the composition for a resin into a mold; and (C) a step in which, by increasing the temperature of a heating medium, the composition for a resin is polymerized in the heating medium that contains a liquid having a thermal conductivity of 0.2 W/m.K or higher, or in a shower of the heating medium. The maximum temperature of the heating medium in step (C) is 55-110 DEG C. (a) A compound which has two episulfide groups per molecule and which is represented by formula. (1) (b) A compound having one or more thiol groups per molecule. 通过本发明，提供环硫系树脂固化物的制造方法，其依次具有：工序(A)：将下述(a)化合物、下述(b)化合物和聚合催化剂混合而得到树脂用组合物；工序(B)：向铸模中注入该树脂用组合物；和工序(C)：在包含导热率为0.2W/m·K以上液体的热介质中或者在该热介质的淋浴中，使所述热介质的温度升温而使所述树脂用组合物聚合，所述工序(C)中的热介质的最高温度为55～110℃。(a)下述(1)式所表示的分子内具有2个环硫基的化合物；(b)1分子中具有1个以上巯基