Packaging substrate and manufacturing method therefor
The invention discloses a packaging substrate and a manufacturing method therefor. An embodiment provides the packaging substrate, wherein packaging substrate comprises a supporting carrying board and a thin type substrate; the supporting carrying board comprises a carrier and a metal dielectric lay...
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| creator | DARCY HU BARRY LI KK KUO TIM ZUO POTATO SHI MASON LIN KENNY LO JERRY CAO KHMER ZHAO EVA LIU |
| description | The invention discloses a packaging substrate and a manufacturing method therefor. An embodiment provides the packaging substrate, wherein packaging substrate comprises a supporting carrying board and a thin type substrate; the supporting carrying board comprises a carrier and a metal dielectric layer with a first surface and a second surface which are arranged oppositely; the first surface is in contact with the carrier; the thin type substrate comprises a first circuit layer, a first dielectric layer which is laminated on the first circuit layer and is in contact with the second surface of the metal dielectric layer, a second circuit layer which is formed in the other side, relative to the first circuit layer, of the first dielectric layer, and a first conductive through hole which is embedded in the first dielectric layer and equipped with opposite first end and second end; the first end is electrically connected with the first circuit layer while the second end is electrically connected with the second ci |
| format | Patent |
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An embodiment provides the packaging substrate, wherein packaging substrate comprises a supporting carrying board and a thin type substrate; the supporting carrying board comprises a carrier and a metal dielectric layer with a first surface and a second surface which are arranged oppositely; the first surface is in contact with the carrier; the thin type substrate comprises a first circuit layer, a first dielectric layer which is laminated on the first circuit layer and is in contact with the second surface of the metal dielectric layer, a second circuit layer which is formed in the other side, relative to the first circuit layer, of the first dielectric layer, and a first conductive through hole which is embedded in the first dielectric layer and equipped with opposite first end and second end; the first end is electrically connected with the first circuit layer while the second end is electrically connected with the second ci</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161214&DB=EPODOC&CC=CN&NR=106229309A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161214&DB=EPODOC&CC=CN&NR=106229309A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DARCY HU</creatorcontrib><creatorcontrib>BARRY LI</creatorcontrib><creatorcontrib>KK KUO</creatorcontrib><creatorcontrib>TIM ZUO</creatorcontrib><creatorcontrib>POTATO SHI</creatorcontrib><creatorcontrib>MASON LIN</creatorcontrib><creatorcontrib>KENNY LO</creatorcontrib><creatorcontrib>JERRY CAO</creatorcontrib><creatorcontrib>KHMER ZHAO</creatorcontrib><creatorcontrib>EVA LIU</creatorcontrib><title>Packaging substrate and manufacturing method therefor</title><description>The invention discloses a packaging substrate and a manufacturing method therefor. 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An embodiment provides the packaging substrate, wherein packaging substrate comprises a supporting carrying board and a thin type substrate; the supporting carrying board comprises a carrier and a metal dielectric layer with a first surface and a second surface which are arranged oppositely; the first surface is in contact with the carrier; the thin type substrate comprises a first circuit layer, a first dielectric layer which is laminated on the first circuit layer and is in contact with the second surface of the metal dielectric layer, a second circuit layer which is formed in the other side, relative to the first circuit layer, of the first dielectric layer, and a first conductive through hole which is embedded in the first dielectric layer and equipped with opposite first end and second end; the first end is electrically connected with the first circuit layer while the second end is electrically connected with the second ci</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Packaging substrate and manufacturing method therefor |
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