Packaging substrate and manufacturing method therefor

The invention discloses a packaging substrate and a manufacturing method therefor. An embodiment provides the packaging substrate, wherein packaging substrate comprises a supporting carrying board and a thin type substrate; the supporting carrying board comprises a carrier and a metal dielectric layer with a first surface and a second surface which are arranged oppositely; the first surface is in contact with the carrier; the thin type substrate comprises a first circuit layer, a first dielectric layer which is laminated on the first circuit layer and is in contact with the second surface of the metal dielectric layer, a second circuit layer which is formed in the other side, relative to the first circuit layer, of the first dielectric layer, and a first conductive through hole which is embedded in the first dielectric layer and equipped with opposite first end and second end; the first end is electrically connected with the first circuit layer while the second end is electrically connected with the second ci