Substrate structure

Provided is a substrate structure, including a substrate body formed with a plurality of electrical contact pads; first and second conductive bumps formed on the electrical contact pads, wherein the width of the second conductive bump is smaller than that of the first conductive bump, and in basis o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAI JIELONG, CHENG LYUYI, LYU ZHANGLUN, CHEN YOUQUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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