Substrate structure

Provided is a substrate structure, including a substrate body formed with a plurality of electrical contact pads; first and second conductive bumps formed on the electrical contact pads, wherein the width of the second conductive bump is smaller than that of the first conductive bump, and in basis of the substrate body, the second conductive bump has a greater height than that of the first conductive bump to thereby compensates the height difference after reflowing the first and second conductive bumps. 种基板结构，包括：具有多个电性接触垫的基板本体、设于该电性接触垫上的第导电凸块以及第二导电凸块，该第导电凸块包含第预焊锡层，且该第二导电凸块包含第二预焊锡层，而该第二导电凸块的宽度小于该第导电凸块的宽度，藉由该第二导电凸块的高度大于该第导电凸块的高度，以于回焊后，利用此高度差补偿第与第二预焊锡层的高度差，而得到高度致的第与第二导电凸块。