Glass mediation layer structure and fabrication method thereof

The invention relates to a glass mediation layer structure and a fabrication method thereof. The glass mediation layer structure comprises a substrate, a buffer layer, a conductive etching-resistant layer, a first electrical wire harness, a through hole and a second electrical wire harness, wherein...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XU WENBIN, CHEN YINGXIAN, ZHENG ZAOSHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a glass mediation layer structure and a fabrication method thereof. The glass mediation layer structure comprises a substrate, a buffer layer, a conductive etching-resistant layer, a first electrical wire harness, a through hole and a second electrical wire harness, wherein the substrate is provided with a first surface and a second surface which are opposite to each other, the buffer layer is arranged on the first surface, the conductive etching-resistant layer is arranged on the buffer layer, the first electrical wire harness is arranged on the conductive etching-resistant layer, the through hole comprises a first through hole and a second through hole, the first through hole penetrates through the substrate, the second through hole penetrates through the buffer layer, the first through hole communicates with the second through hole, the second electrical wire harness is arranged on the second surface, the first through hole and the second through hole are filled with the second ele