Clock signal alignment for system-in-package (SIP) devices

A method embodiment of the present disclosure includes receiving a delay value associated with an interconnect delay that is measured across interconnect circuitry communicatively coupling a host semiconductor device with a semiconductor device. The method also includes delaying a local clock signal by an amount of delay indicated by the delay value to produce a delayed local clock signal. The method also includes receiving a delayed source clock signal, where the delayed source clock signal is received from the host semiconductor device via the interconnect circuitry. The method also includes outputting a master clock signal based on a comparison of the delayed source clock signal and the delayed local clock signal, where the master clock signal is utilized to generate one or more aligned clock signals on the semiconductor device that are aligned with a source clock signal generated on the host semiconductor device. 本发明的种方法实施例包括接收与互连延迟相关联的延迟值，所述互连延迟的互连电路上测得，互连电路通信地耦合主机半导体装置与半导体装置。所述方法还包括使本地时钟信号延迟由所述延迟值指示的延迟量