Shielding assembly of electronic equipment

The invention provides a shielding assembly of electronic equipment. The electronic equipment comprises a heat generation hardware module arranged on a printed circuit board (PCB), a shielding assembly which is above the hardware module and comprises a partially-encircled part having an opening communicated with the hardware module, and a heat conduction board which directly contacts with the hardware module through the opening, wherein the shielding assembly comprises an electrical conduction part which is above the opening and is used for sealing the shielding assembly above the hardware module and is used for conducting heat. The method for manufacturing the electronic equipment comprises steps that at a surface mounting stage, the hardware module is positioned on the PCB; the partially-encircled part of the shielding assembly is positioned above the hardware module; after the surface mounting stage, the heat conduction board is positioned to realize direct contact with the hardware module through the open