Manufacturing method for conductive member, with cavity included end portion, of electronic component

The invention relates to a manufacturing method for a conductive member, with a cavity included end portion, of an electronic component. The method comprises that a structure with at least one blind hole is provided, the blind whole includes a bottom portion and at least one internal side surface, and the side surface is connected to the bottom portion via a base part of the side surface; and the member is formed by growing a conductive material so that at least part of the member is formed in the blind hole, the base body of the side surface of the blind hole is grown faster than other parts of the side surface, the formed member comprises a cavity which is arranged at the end portion, opposite to the bottom portion of the blind hole, of the member, and the cavity is defined wholly or partially by a frame. 本发明涉及种制造用于电子元件的包括带腔体的端部的导电构件的方法，包括以下步骤：配备包括至少个盲孔的结构，所述盲孔具有底部和至少个内部旁侧面，所述旁侧面经其基部连接到所述底部；形成构件，此形成步骤包括生长导电材料以便在盲孔中形成构件的至少部分的步骤，所述生长在盲孔的旁侧面的基部比在所述旁侧面其它部分快，所述构件形成后包含布置在其与盲孔的底部相对的端部的腔体，所述腔体由边框全部或部分地界定。