SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

The present disclosure relates to a semiconductor package and method of manufacturing the same. The semiconductor package includes a first die, a plurality of conductive pads, a package body and a plurality of first traces. The plurality of conductive pads electrically connect to the first die, and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, WILLIAM T, SU, YUANANG, ESSIG, KAY STEFAN, APPELT, BERND KARL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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