Wafer encapsulation method

The invention discloses a wafer encapsulation method. The method comprises the following steps that: a wafer cutter is utilized to cut a wafer, a wafer is sucked by a wafer mounting device, and the tin bumps of the wafer are coated with soldering flux; a paste coating and printing device is utilized to apply non-conductive paste onto the front surface of a substrate by means of steel plate printing, rubber head transfer or air valve jet printing; the tin bumps are directly welded on the copper pads of the substrate through using a post-tin melting welding technology under 290 DEG C to 300 DEG C; a post-wafer mounting material is baked, and plasma cleaning and resin mould pressing encapsulation are carried out; and a post-tin melting welding encapsulation body can be obtained. According to the wafer encapsulation method of the invention, the post-tin melting welding encapsulation body is obtained through a post-tin melting welding procedure; the post-tin melting welding encapsulation body requires the applicat