Diamond wire cutting liquid and preparing method and using method thereof

The invention discloses diamond wire cutting liquid and a preparing method and using method thereof. Trans-block polyether, amino polyether and polyalcohol are used as raw materials, defoaming capacity, dispersing capacity and cleaning capacity of the cutting liquid are enhanced, and pipe blockage c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YE DUN, DENG SHUN, GUO HAIJIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses diamond wire cutting liquid and a preparing method and using method thereof. Trans-block polyether, amino polyether and polyalcohol are used as raw materials, defoaming capacity, dispersing capacity and cleaning capacity of the cutting liquid are enhanced, and pipe blockage caused by silica powder agglomeration or deposit and etching hickie and white dots, caused by cutting liquid residual, in the latter process are avoided. As the cutting liquid is mainly of polyether, the cutting liquid has excellent lubricating, cooling and defoaming performance at low concentration, emission of COD in cutting waste liquid is greatly reduced, and being free of an organic silicon deforming agent, the cutting waste liquid is easy to treat. The diamond wire cutting liquid is suitable for wire cutting of diamond and particularly cutting solar crystal silicon wafer. 本发明公开了种金刚石线切割液、其制备方法及使用方法,采用反式嵌段聚醚、氨基聚醚及聚多元醇为原料,增强了切割液的消泡能力、分散能力和清洗能力,避免了硅粉团聚或沉积引起的管道堵塞以及切割液残留引起的后道工序制绒白斑白点等缺陷,同时由于切割液主要由聚醚组成,在较低浓度下就具备优良的润滑