Ceramic carrier and sensor element, heating element and sensor module, each with a ceramic carrier and method for manufacturing a ceramic carrier

The present invention relates to a ceramic carrier, in particular an Al2O3 carrier, on which a thin-film structure (10) of platinum or a platinum alloy is arranged, wherein the carrier and/or the thin-film structure (10) are adapted in order to reduce mechanical stresses owing to different thermal expansion coefficients. The carrier and/or the thin-film structure (10) comprise the following: e) a surface (11) of the carrier in the region of the thin-film structure (10) is smoothed at least in sections to reduce the adhesion and/or f) a/the surface (11) of the carrier has an intermediate layer (12) on which the thin-film structure (10) is arranged, wherein the thermal expansion coefficient of the intermediate layer (12) is from 8*10-6/K to 16*10-6/K, in particular from 8.5*10-6/K to 14*10-6/K, and/or g) the thin-film structure (10) has at least one conductor path (13) that is undular at least in sections, said conductor path extending laterally along a/the surface (11) of the carrier, wherein the amplitude of