Cylinder plating apparatus and method

Provided are a cylinder plating apparatus and method with which a constant distance can be maintained between a cylinder for processing and insoluble electrodes, regardless of the diameter of the cylinder for processing, and current density to the insoluble electrodes can be reduced by increasing the surface area of the insoluble electrodes, thereby reducing the load on the insoluble electrodes. In this cylinder plating apparatus, a pair of insoluble electrodes that have a shape at least the lower section of which is curved inward, and that at least the lower section of which is a comb-tooth shaped portion, are brought into proximity to both sides of a cylinder for processing, at prescribed spacing therefrom, and plating is carried out on the outside peripheral surface of the cylinder for processing. The insoluble electrodes are positioned alternately facing one another such that protruding portions of the comb-tooth shaped portion of one of the insoluble electrodes are positioned at locations of recessed por