Adhesive composition using polyamide-imide resin

Provided is an adhesive composition using a polyamide-imide resin which is suitable for uses such as flexible printed wiring boards. This adhesive composition in which a polyamide-imide resin and an epoxy resin are combined is characterised in that: (A) 15-40 parts by mass of the epoxy resin is adde...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANE TAKEHISA, OBA HISAE, EBIHARA SATOSHI, HAMANO MASAMI, KOYANAGI HIDEYUKI, OKANO KOUJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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