Adhesive composition using polyamide-imide resin

Provided is an adhesive composition using a polyamide-imide resin which is suitable for uses such as flexible printed wiring boards. This adhesive composition in which a polyamide-imide resin and an epoxy resin are combined is characterised in that: (A) 15-40 parts by mass of the epoxy resin is added relative to 85-60 parts by mass of the polyamide-imide resin; (B) a phosphorus-containing epoxy resin is not used as the epoxy resin, or if used, the amount of phosphorus-containing epoxy resin added is extremely small; and (C) the polyamide-imide resin comprises constituent units derived from specific acid components, and a constituent unit derived from a diisocyanate component having an aromatic ring or from a diamine component having an aromatic ring, wherein if the constituent units derived from all of the acid components of the polyamide-imide resin are 100 mol%, the constituent units respectively derived from the acid components have a specific ratio. 本申请提供种适用于柔性印刷电路板等用途的使用聚酰胺酰亚胺树脂的粘合剂组合物。种粘合剂组合物，其特征在于，混合有聚