Raw ceramic chip laminating device and method

The invention discloses a raw ceramic chip laminating device and method and belongs to the technical field of microwave integrated circuits. The device comprises a base plate, a coarse positioning pin, a first leveling screw and a second leveling screw, wherein a counter bore is formed in the back side of the coarse positioning pin on the base plate, so that the lower surface of the base plate can be closely attached to transparent glass on a parallel light platform during laminating; a nut of the coarse positioning pin is designed to be in a countersunk head form, so that the base plate can be closely attached to the parallel light platform conveniently during laminating; the lower half section of the coarse positioning pin is provided with threads, so that the coarse positioning pin can be screwed and fixed into the base plate conveniently. By the adoption of the device and method, it is guaranteed that raw ceramic chips can enter the laminating procedure smoothly without stretching, breaking, torsion, defo