Process for compositing wafers in inner caps

The invention provides a process for compositing wafers in inner caps. By means of the process, sealing structures can be rapidly composited in the inner caps, and the production efficiency is improved. The process for compositing the wafers in the inner caps is characterized in that a whole raw material structure is utilized for directly punching raw material sealing pieces, and the punched raw material sealing pieces are directly downwards pressed into the inner caps of covers under the raw material sealing pieces through a punching head to complete compositing; the compositing process of the raw material sealing pieces and the inner caps is accelerated through heating structures, and therefore compositing is tight and rapid. 本发明提供了种向内盖内复合圆片的工艺，其使得密封结构快速复合于内盖内，提高了生产效率。其特征在于：其利用整张原料结构直接冲压出原料密封片，冲压后的原料密封片直接被冲头下压至正下方的盖子的内盖内完成复合，所述原料密封片和所述内盖复合过程中通过加热结构加速复合过程，使得复合紧密快速。