Structure for compositing wafers in inner caps

The invention provides a structure for compositing wafers in inner caps. By means of the structure, sealing structures can be rapidly composited in the inner caps, and the production efficiency is improved. The structure for compositing the wafers in the inner caps comprises a punching head on the upper portion and a lower punching cutting die on the lower portion, a raw material structure is laid at the upper end of the lower punching cutting die, the lower punching cutting die is internally provided with multiple lower cutting edges, the position over each lower cutting edge is provided with a corresponding upper cutting edge, the top of each upper cutting edge is fixedly installed at the lower end of the punching head, a heating coil is arranged on the outer ring surface of the lower portion of each upper cutting edge, a cover laying table is arranged below the lower punching cutting die, covers are laid on the cover laying table, the inner caps of the covers face upwards, one cover is arranged on the port